OEM Final Design Support
Review of PCB layout: Design rules, penalization, tooling, rework considerations etc.
Technical Issue Resolution.
Redesign/Cost Reduction Programs.
Regulatory Compliance Support.
Feedback after each prototype run.
SMT assembly lines.
BGA, Micro BGA, Fine Pitch 01005 and all market requirements capabilities.
Automated solder paste application. Surface & paste volume measurement (POI).
Automated visual inspection (AOI)
X-Ray, Rework BGA station.
Compliance with RoHS/Non-RoHS requirements.
Compliance with Aerospace / Military standards
TH insertion (RoHS & Non-RoHS - 2 wave soldering lines).
TH Selective wave soldering.
Press Fit Machines.
Electromechanical assembly lines.
Product integration and test.
Conformal Coating process (Vapor cleaning & XYZ coating machine).
Functional test – board level and systems, Burn In chambers.
Liat Electronics startup Center believes on entire production chain under a single roof.
Technical support throughout all development and production stages.
Enhanced quality inspections to compensate for lack of effective test capabilities
at prototype stage.
Early Stage NPI.