Engineering Services
OEM Final Design Support
Review of PCB layout: Design rules, penalization, tooling, rework considerations etc.
Technical Issue Resolution.
Cost Reduction Programs.
Regulatory Compliance Support.
Feedback after each prototype run.
Technologies
SMT assembly lines.
BGA, Micro BGA, Fine Pitch 01005 and all market requirements capabilities.
Automated solder paste application. Surface
& paste volume measurement (POI).
Automated visual inspection (AOI)
X-Ray, Rework BGA station.
Vapor phase.
Compliance with RoHS/Non-RoHS requirements.
Compliance with Aerospace / Military standards
TH insertion (RoHS & Non-RoHS - 2 wave soldering lines).
TH Selective wave soldering.
Press Fit Machines.
Electromechanical assembly lines.
Product integration and test.
Conformal Coating process (Vapor cleaning & XYZ coating machine).
Functional test – board level and systems, Burn In chambers.
STARTUP CENTER
Liat Electronics startup Center believes on entire production chain under a single roof.
NPI
Process Implementation.
Technical support throughout all development and production stages.
Enhanced quality inspections to compensate for lack of effective test capabilities
at prototype stage.
Systems Documentation.
Early Stage NPI.